2023.06.15
An article “Cu sinter Paste, a Bonding Material with Great Potential (Part 1)” has been published on the M Lab. website, Stories page.
The story of “Cu sinter paste,” as told by its chief developer, will be published in three installments.
This first installment is titled, “ Cu Sinter Paste, a Bonding Material with Great Potential 【Part 1】– Helping to Boost Power Device Functionality.”