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MicroThin® copper foil with carrier film


Our MicroThin® copper foil is an ultra-thin copper foil of 2 to 5-μm-thickness with carrier film. In Modified Semi Additive Process (MSAP), this foil can be used as base copper to produce ultra-high-precision circuit boards. It is the global standard for ultra-thin copper foils.

Electro-deposited copper foil for printed wiring boards (PWBs)


This product is available in a variety of foil and surface treatment options, such as a low profile copper foil, a copper foil with super fine nodules, for use in various applications.

Resin-coated copper foil


This is a composite material that has a layer of semi-hardened resin applied on a copper foil. Unlike other materials that contain glass cloth, this product is excellent for designing slim substrates and creating vias in circuits. It is used as the outer layer for motherboards in several hundred million mobile phones every year.

Material of capacitors embedded in PWBs (FaradFlexR)


This product, when used as voltage and ground planes, offers uniform power distribution and suppresses noises.

Solder powder


This solder powder is made using a centrifugal spraying system that produces spherical fine powder with little oxidation.

Mechatronics Business


Mitsui Kinzoku Instrumentations Technology Corporation was formed through a merger between Mitsui Kinzoku’s Instrumentation Systems Division ? which was the world’s first company … Read more

IT Systems


YOURSOFT Inc. drives the IT efforts within the Mitsui Kinzoku Group, and also uses its experience and know-how to serve organizations outside the group, in all industries and sectors, in Japan and overseas. Read more

Cerium Oxide Abrasives


This abrasive is based on cerium oxide, and is available in various particle sizes for rough polishing to finishing work. It is used in leading edge industries to polish glass substrates for hard disks and LCD panels.

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