Promising Material
Intelligence
Material Intelligence
Copper foil acts as the essential electronic materials nowadays.
In order to strengthen the quality and trust from customers,
Mitsui Kinzoku will continue to accumulate and utilize the "Material Intelligence" in the future.
Technology & Facility
We combine product processing technologies exceeding 500 in total,
and we will deliver the best products.
Globalization
A business base of development, production, and processing logistics
spreading throughout the world, mainly in Asia and North America
Solution
Responding to various PCB request from smaller
IC-Substrate to bigger Multi-Layer PCB
Semiconductor
Package(PKG)
High Speed
Digital(HSD)
Flexible Printed
Circuit(FPC)
High Density
Interconnect(HDI)
Other
application
News
- 1.Feb.2023
- Opening a co-creation partner recruitment site for new applications of copper foil.
- 15.Mar.2018
- Publishing Copper Foil Roadmap for IC-Substrate
- 20.Dec.2017
- Renewal Web Site.
- 20.Dec.2017
- Publishing Copper Foil Virtual Fitting.