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Copper Foil Virtual Fitting
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Process flow

Please select the circuit specifications and process information you want to form from the following choices.
We propose optimum copper foil from our copper foil lineup.

Patterning process

Tenting
Tenting
MSAP
MSAP
SAP
SAP

Target pattern pitch

Method for making via hole

CO2 laser drilling
UV laser drilling
Mechanical drilling

Process flow of Tenting

    • 1

    • Lamiate Press

    • 2

    • Pre-treatment for
      Laser drilling

    • 3

    • Laser drilling

    • 4

    • De-smear

    • 5

    • Micro etching after
      Laser drilling

    • 6

    • Pre-treatment for
      E'less Cu plating

    • 7

    • E'less Cu plating

    • 8

    • Pre-treatment for
      Dry film lamination

    • 9

    • Dry film lamination

    • 10

    • Dry film exposure

    • 11

    • Dry film developing

    • 12

    • Dry film residue
      removing

    • 13

    • Pattern plating

    • 14

    • Dry film stripping

    • 15

    • Flash etching

Please select

Patterning process　※Please select from 3 patterns.

Tenting
Tenting
MSAP
MSAP
SAP
SAP
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Please select

Target pattern pitch

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Please select

Method for making via hole

img-responsive
Please select

Pre-treatment for Laser drilling

img-responsive
Please select

Micro etching after Laser drilling

img-responsive
Please select

Pre-treatment for E'less Cu plating

img-responsive
Please select

Target pattern pitch

img-responsive
Please select

Method for making via hole

img-responsive
Please select

Pre-treatment for Laser drilling

img-responsive
Please select

Micro etching after Laser drilling

img-responsive
Please select

Pre-treatment for E'less Cu plating

img-responsive
Please select

Target pattern pitch

img-responsive
Please select

Method for making via hole

img-responsive
Please select

Pre-treatment for Laser drilling

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