MITSUI KINZOKU Copper Foil Division

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Copper Foil Roadmap for IC-Substrate
Home / Copper Foil Roadmap for IC-Substrate
Products Lineup(Thickness)
Products Lineup(Roughness)
Copper Foil Virtual Fitting
Copper Foil Roadmap for IC-Substrate

You can select the optimum copper foil, referring to the PCB process and target Line space (L/S) on the following roadmap.
Product catalogue can be downloaded by clicking the button next to the product name.

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