- Copper is challenging to be fully densified via additive manufacturing
due to its high reflectivity of IR laser and high thermal conductivity.
We have the two copper alloy grades for L-PBF (laser powder bed fusion)
with great performance of 3D printed parts by achieving full densification
with the IR laser output of 400W. We have the standard parameters for both
and can share them with you based on NDA, which can reduce development
cost on your side.
- Features
electrical conductivity of 95%IACS and thermal conductivity of 377W/mK
Applications
thermal management applications including heat sink and cold plate, induction
coil, rocket chamber and high electrical applications for EVs: motor, connector
and bus bar
High Conductivity Grade:MA-CCR25L
- Features
high tensile strength:755MPa, comparable to copper beryllium with conventional
process
Applications
tooling, tip for welding and inlet guide vanes
High Strength Grade MA-CCR25H
