Metal Powder for electronic

  • Features
  • Utilizing our own wet process, we could offer fine powders with high dispersion, high packing property and sharp size distribution.
  • Applications
    (1) Thick film conductive paste (sintering /polymer type)
    (2) Electrode material for LTCC / MLCC
    (3) Through-hole paste
    (4) Conductive adhesive

Copper Powder(Wet process)


  • Features
  • Utilizing our own designed high-pressure atomized process, we could offer fine powders . Especially, K series is fine powder with high sphericity and sharp particle size as compared with conventional items.
  • Applications
    (1) Thick film conductive paste (sintering /polymer type)
    (2) Electrode material for LTCC / MLCC
    (3) Through-hole paste
    (4) Conductive adhesive

Copper Powder(Atomaization process)


  • Features
  • We could offer a wide variety of flake/plate shaped powders using our wet and atomized powders. We could adjust thickness and particle that powders.
  • Applications
    (1) Thick film conductive paste (sintering /polymer type)
    (2) Electrode material for LTCC / MLCC
    (3) Through-hole paste
    (4) Conductive adhesive

Copper Flake Powder


  • Features
  • Utilizing our own pulverization process, we could offer powders with high packing property.
  • Applications
    (1) Through-hole paste
    (2) Thick film conductive paste (sintering /polymer type)
    (3) Electrode material for LTCC / MLCC
    (4) EMI shield
    (5) Conductive adhesive

Copper Powder(Electrolytic process)


  • Features
  • Using advansed technology and accumulated know-how, we developed high performance Ag coated Cu powders. We could offer powders that meet the required properties such as dispersity, shape and conductivity.
  • Depending on the purpose, particle size, shape, coat ratio can be selected. In addition, we could also coat other than silver.

Silver coated Copper Powder


  • Features
  • Utilizing our own wet process, we could offer the powder with high dispersion, high filling, and sharp size distribution.
  • Applications
    (1) Thick film conductive paste (sintering /polymer type)
    (2) Electrode materials for PV (Photovoltaics)
    (3) Electrode materials for Touch panel
    (4) Conductive adhesive

Silver Powder

  • Features
  • Fine and uniform thickness with few coarse particles.
    We can adjust particle size and thickness as you need.
    High conductivity due to flake-to-flake contact.
  • Applications
    (1) Adhesive material

Silver Flake