- Features
- Utilizing our own designed high-pressure atomized process, we could offer
fine powders. Especially, K series is fine powder with high sphericity
and sharp particle size as compared with conventional items.
- Applications
(1) Thick film conductive paste (sintering /polymer type)
(2) Electrode material for LTCC / MLCC
(3) Through-hole paste
(4) Conductive adhesive
- Features
- Utilizing our own wet process, we could offer fine powders with high dispersion,
high packing property and sharp size distribution.
- Applications
(1) Thick film conductive paste (sintering /polymer type)
(2) Electrode material for LTCC / MLCC
(3) Through-hole paste
(4) Conductive adhesive
- Features
- Using advansed technology and accumulated know-how, we developed high performance Ag coated Cu powders. We could offer powders that meet the required properties such as dispersity, shape and conductivity
- Depending on the purpose, particle size, shape, coat ratio can be selected.
In addition, we could also coat other than silver..
- Features
- We could offer a wide variety of flake/plate shaped powders using our wet
and atomized powders. We could adjust thickness and particle that powders.
- Applications
(1) Thick film conductive paste (sintering /polymer type)
(2) Electrode material for LTCC / MLCC
(3) Through-hole paste
(4) Conductive adhesive
- Features
- Utilizing our own pulverization process, we could offer powders with high
packing property.
- Applications
(1) Through-hole paste
(2) Thick film conductive paste (sintering /polymer type)
(3) Electrode material for LTCC / MLCC
(4) EMI shield
(5) Conductive adhesive
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This is a relatively large-diameter copper powder manufactured using our own atomization technology.
- Features
- Features
- Utilizing our own wet process, we could offer the powder with high dispersion,
high filling, and sharp size distribution.
- Applications
(1) Thick film conductive paste (sintering /polymer type)
(2) Inductors,Electrode material for LTCC
(3) Electrode materials for Touch panel
(4) Conductive adhesive