- Features
- Utilizing our own designed high-pressure atomized process, we could offer
fine powders . Especially, K series is fine powder with high sphericity
and sharp particle size as compared with conventional items.
- Applications
(1) Thick film conductive paste (sintering /polymer type)
(2) Electrode material for LTCC / MLCC
(3) Through-hole paste
(4) Conductive adhesive
- Features
- Utilizing our own wet process, we could offer fine powders with high dispersion,
high packing property and sharp size distribution.
- Applications
(1) Thick film conductive paste (sintering /polymer type)
(2) Electrode material for LTCC / MLCC
(3) Through-hole paste
(4) Conductive adhesive
- Features
- Utilizing our own wet process, we could offer the powder with high dispersion,
high filling, and sharp size distribution.
- Applications
(1) Thick film conductive paste (sintering /polymer type)
(2) Electrode materials for PV (Photovoltaics)
(3) Electrode materials for Touch panel
(4) Conductive adhesive
- Features
- We could offer a wide variety of flake/plate shaped powders using our wet
and atomized powders. We could adjust thickness and particle that powders.
- Applications
(1) Thick film conductive paste (sintering /polymer type)
(2) Electrode material for LTCC / MLCC
(3) Through-hole paste
(4) Conductive adhesive
- Features
- Utilizing our own pulverization process, we could offer powders with high
packing property.
- Applications
(1) Through-hole paste
(2) Thick film conductive paste (sintering /polymer type)
(3) Electrode material for LTCC / MLCC
(4) EMI shield
(5) Conductive adhesive
- Features
- Using advansed technology and accumulated know-how, we developed high performance
Ag coated Cu powders. We could offer powders that meet the required properties
such as dispersity, shape and conductivity.
- Depending on the purpose, particle size, shape, coat ratio can be selected.
In addition, we could also coat other than silver.
Copper Powder(Wet process)
Copper Powder(Atomaization process)
Copper Powder(Electrolytic process)
Silver coated Copper Powder
- Features
- Fine and uniform thickness with few coarse particles.
We can adjust particle size and thickness as you need.
High conductivity due to flake-to-flake contact.
- Applications
(1) Adhesive material
