Open Innovation Hub
Create new business
through market co-creation
We pursue co-creation networking,
materialization of ideas into new products
and co-creation of new markets.
Cu Sinter Paste, a Bonding Material with Great Potential 【Part 3】
Cu sinter paste additionally offers an environmental benefit by eliminating lead when replacing solder.
Cu Sinter Paste, a Bonding Material with Great Potential 【Part 2】
Mitsui Kinzoku is engaging in the development of high-quality Cu sinter paste by capitalizing on its metal powder management technologies developed during many years of handling copper powder.
Cu Sinter Paste, a Bonding Material with Great Potential 【Part 1】
Cu sinter paste is expected to be utilized to replace conventional solder as a bonding material in power devices (power semiconductors).
MOF is a Next-Generation Material Contributing to Wide-Ranging Industries 【Part 3】
Capable of absorbing, separating and converting carbon dioxide, MOFs are expected to contribute to solving environmental issues.
MOF is a Next-Generation Material Contributing to Wide-Ranging Industries 【Part 2】
Mitsui Kinzoku embarked its MOF business upon its encounter with Atomis, a startup funded by the corporate venture capital.
MOF is a Next-Generation Material Contributing to Wide-Ranging Industries 【Part 1】
In this three-part series, we will introduce MOF through an interview with Mr. Matsumae, Market Co-Creation PJ Group Manager and MOF PJ Leader.
Mission, Vision, Value
"If only there was a material with such a property"
"What material will enable us to implement this technology?”
”Is there any way to reduce costs?”
Mitsui Kinzoku is here to help developers and engineers who squarely face a range of challenges such as these on a daily basis.
We have a track record of leveraging "encounters" with different fields, novel technologies and unique processes to bring forth new businesses.
We are willing to collaborate with you to develop new businesses and products through the synergy between your needs and our technologies and resources.
We have three distinctive technological edges
to offer to help our partners develop
advanced materials for the future.
Mitsui Kinzoku offers a wide range of technological solutions through the approach of altering material properties: Using appropriate methods, we develop new alloys suited for a particular use, change metals into non-metal materials, and design metal-resin composites. With a wealth of knowledge in materials and expertise in material design and powder control technology, we will explore even more opportunities to offer solutions.
Mitsui Kinzoku specializes in surface treatment. We add nano-sized active components to the surface of a material to develop a catalyst that performs a chemical function, or apply a coating to the surface of a material to provide it with insulation properties. We are searching for applications in which our unique surface technology can effectively fulfill customers' requirements.
MaterialShape and Size
Mitsui Kinzoku also has a competitive edge in material processing technology. We are a global leader of ultra-thin electrodeposit copper foil in development and production through our established technology that can stably mass-produce MicroThinTM copper foil. We are also capable of altering the shape and size of particles, including increasing their size and introducing additional complexity into their shape. We hope to offer our shape-engineering technology and capability to stably mass-produce innovative products to more industry sectors.
Corporate Venture Capital
We pursue co-creation of new businesses
through collaboration with startups.
Business Fields of Focus
The digest of the oral presentation on Cu sinter paste for pressure sintering at PCIM Europe 2023.
Micro Particle Phosphor, published on the New Technology Projects page.
New article entitled “Cu sinter Paste, a Bonding Material with Great Potential (Part 3)” published on the Stories page.
A-SOLiD™, a Solid Electrolyte for All-Solid-State Batteries, published on the New Technology Projects page.
New article entitled “Cu sinter Paste, a Bonding Material with Great Potential (Part 2)” published on the Stories page.
New pages entitled “New Technology Projects” published on the M Lab. website.