Product Information
We have developed a copper sinter paste as a bonding material for next generation power semiconductors. This product is expected to be a reliable, heat resistant, and environmentally friendly (lead free) material for high output, reliable power devices used in EV, electricity generating/distributing devices, industrial devices, etc. Our product range features products optimized through our original material design for both pressure bonding and non-pressure bonding manufacturing processes.
Recent Activities
Exhibition/Conference List
| Year | Exhibition/Conference | Title |
|---|---|---|
| 2018 | TMS2018 | Low Temperature Bonding Material with Submicron Copper Particles |
| PCIM Europe2018 | Sintering Cu paste die-attach for high TJ power devices | |
| 3D-PEIM2018 | New bonding Cu ink by using low temperature sinterable Cu particles | |
| IMPACT2018 | Development of high performance synchronous rectifier module by multi-chip Cu sintering technology | |
| 2019 | PCIM Europe2019 | The characteristics of Sintered Copper Layer by Pressure Sintering Process for Power Module Application |
| ECTC2019 | The properties of Cu sinter paste for pressure sintering at low temperature | |
| ISAPP2019 | Reliabilities of Cu sinter paste for pressure sintering at low temperature | |
| 2020 | Mate2020 | Joining Properties of Cu Sinter Material by Pressure Sintering Process |
| PCIM Europe2020 | Bonding with copper paste for pressure sintering process | |
| ECTC2020 | The bonding properties of various surface finishes with Cu paste for pressure sintering | |
| 2021 | PCIM Europe2021 | Bonding Properties of Cu Sinter Paste for Pressureless Sintering Process |
| 2022 | ECTC2022 | Bonding Properties of Cu Paste in Low Temperature Pressureless Processes |
| PCIM Europe2022 | Bonding Properties and Reliability Evaluation of Cu Paste in Low Temperature Pressureless Sintering | |
| 2023 | ICEP2023 | Reliability Evaluation of SiC/Cu Substrate Die-attached Modules with Sintered Cu Joint and Pb-free Solder |
| PCIM Europe2023 |
Bonding Properties and Reliability Evaluation of Cu Sinter Paste for Pressure SinteringMore
|
CVC
Corporate Venture Capital
We pursue co-creation of new businesses
through collaboration with startups.
Business Fields of Focus
STORIES
New Materials
DOWNLOAD
Download a Document
Click category to download
