We have developed a copper sinter paste as a bonding material for next generation power semiconductors. This product is expected to be a reliable, heat resistant, and environmentally friendly (lead free) material for high output, reliable power devices used in EV, electricity generating/distributing devices, industrial devices, etc. Our product range features products optimized through our original material design for both pressure bonding and non-pressure bonding manufacturing processes.
|2018||TMS2018||Low Temperature Bonding Material with Submicron Copper Particles|
|PCIM Europe2018||Sintering Cu paste die-attach for high TJ power devices|
|3D-PEIM2018||New bonding Cu ink by using low temperature sinterable Cu particles|
|IMPACT2018||Development of high performance synchronous rectifier module by multi-chip Cu sintering technology|
|2019||PCIM Europe2019||The characteristics of Sintered Copper Layer by Pressure Sintering Process for Power Module Application|
|ECTC2019||The properties of Cu sinter paste for pressure sintering at low temperature|
|ISAPP2019||Reliabilities of Cu sinter paste for pressure sintering at low temperature|
|2020||Mate2020||Joining Properties of Cu Sinter Material by Pressure Sintering Process|
|PCIM Europe2020||Bonding with copper paste for pressure sintering process|
|ECTC2020||The bonding properties of various surface finishes with Cu paste for pressure sintering|
|2021||PCIM Europe2021||Bonding Properties of Cu Sinter Paste for Pressureless Sintering Process|
|2022||ECTC2022||Bonding Properties of Cu Paste in Low Temperature Pressureless Processes|
|PCIM Europe2022||Bonding Properties and Reliability Evaluation of Cu Paste in Low Temperature Pressureless Sintering|
|2023||ICEP2023||Reliability Evaluation of SiC/Cu Substrate Die-attached Modules with Sintered Cu Joint and Pb-free Solder|
Bonding Properties and Reliability Evaluation of Cu Sinter Paste for Pressure SinteringMore
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Cu Sinter Paste, a Bonding Material with Great Potential 【Part 3】
Cu sinter paste additionally offers an environmental benefit by eliminating lead when replacing solder.
Cu Sinter Paste, a Bonding Material with Great Potential 【Part 2】
Mitsui Kinzoku is engaging in the development of high-quality Cu sinter paste by capitalizing on its metal powder management technologies developed during many years of handling copper powder.
Cu Sinter Paste, a Bonding Material with Great Potential 【Part 1】
Cu sinter paste is expected to be utilized to replace conventional solder as a bonding material in power devices (power semiconductors).
MOF is a Next-Generation Material Contributing to Wide-Ranging Industries 【Part 3】
Capable of absorbing, separating and converting carbon dioxide, MOFs are expected to contribute to solving environmental issues.
MOF is a Next-Generation Material Contributing to Wide-Ranging Industries 【Part 2】
Mitsui Kinzoku embarked its MOF business upon its encounter with Atomis, a startup funded by the corporate venture capital.
MOF is a Next-Generation Material Contributing to Wide-Ranging Industries 【Part 1】
In this three-part series, we will introduce MOF through an interview with Mr. Matsumae, Market Co-Creation PJ Group Manager and MOF PJ Leader.