MOF (Metal-Organic Framework) * also known as:
PCP (Porous Coordination Polymer)

Cu Sinter Paste, a Bonding Material with Great Potential 【Part 3】

2023.08.03

Cu sinter paste additionally offers an environmental benefit by eliminating lead when replacing solder.

Cu Sinter Paste, a Bonding Material with Great Potential 【Part 2】

2023.07.04

Mitsui Kinzoku is engaging in the development of high-quality Cu sinter paste by capitalizing on its metal powder management technologies developed during many years of handling copper powder.

Cu Sinter Paste, a Bonding Material with Great Potential 【Part 1】

2023.06.15

Cu sinter paste is expected to be utilized to replace conventional solder as a bonding material in power devices (power semiconductors).

MOF is a Next-Generation Material Contributing to Wide-Ranging Industries 【Part 3】

2023.04.25

Capable of absorbing, separating and converting carbon dioxide, MOFs are expected to contribute to solving environmental issues.

MOF is a Next-Generation Material Contributing to Wide-Ranging Industries 【Part 2】

2023.04.25

Mitsui Kinzoku embarked its MOF business upon its encounter with Atomis, a startup funded by the corporate venture capital.

MOF is a Next-Generation Material Contributing to Wide-Ranging Industries 【Part 1】

2023.04.25

In this three-part series, we will introduce MOF through an interview with Mr. Matsumae, Market Co-Creation PJ Group Manager and MOF PJ Leader.