焼結型銅ペースト

商品説明

次世代パワー半導体接合材料として焼結型銅ペーストを開発しております。当製品はEV、発電・送配電機器、産業機器等の用途で高出力・高信頼性が求められるパワーデバイス向けに高信頼・高耐熱・低環境負荷(鉛フリー)の材料として期待されております。
また、独自の材料設計により加圧接合、無加圧接合それぞれの製造プロセスに適した製品をラインアップしております。

展示会、学会発表リスト

年	展示会・学会	タイトル
2018	TMS2018	Low Temperature Bonding Material with Submicron Copper Particles
	PCIM Europe2018	Sintering Cu paste die-attach for high TJ power devices
	3D-PEIM2018	New bonding Cu ink by using low temperature sinterable Cu particles
	IMPACT2018	Development of high performance synchronous rectifier module by multi-chip Cu sintering technology
2019	PCIM Europe2019	The characteristics of Sintered Copper Layer by Pressure Sintering Process for Power Module Application
	ECTC2019	The properties of Cu sinter paste for pressure sintering at low temperature
	ISAPP2019	Reliabilities of Cu sinter paste for pressure sintering at low temperature
2020	Mate2020	Joining Properties of Cu Sinter Material by Pressure Sintering Process
	PCIM Europe2020	Bonding with copper paste for pressure sintering process
	ECTC2020	The bonding properties of various surface finishes with Cu paste for pressure sintering
2021	PCIM Europe2021	Bonding Properties of Cu Sinter Paste for Pressureless Sintering Process
2022	ECTC2022	Bonding Properties of Cu Paste in Low Temperature Pressureless Processes
2022	PCIM Europe2022	Bonding Properties and Reliability Evaluation of Cu Paste in Low Temperature Pressureless Sintering
2023	ICEP2023	Reliability Evaluation of SiC/Cu Substrate Die-attached Modules with Sintered Cu Joint and Pb-free Solder
2023	PCIM Europe2023	Bonding Properties and Reliability Evaluation of Cu Sinter Paste for Pressure SinteringMore